Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member

ABSTRACT

An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of prior Applicationnumber 17/144,643, filed on Jan. 8, 2021, which is a continuationapplication of prior Application number 16/281,752, filed on Feb. 21,2019, which has issued as U.S. Pat. No. 10,893,637 on Jan. 12, 2021 andis based on and claims priority under 35 U.S.C. §119(a) of a Koreanpatent application number 10-2018-0020517, filed on Feb. 21, 2018, andof a Korean patent application number 10-2018-0106851, filed on Sep. 7,2018, in the Korean Intellectual Property Office, the disclosure of eachof which is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to an electronic device including a structure forshielding a magnetic force between electronic components.

2. Description of the Related Art

Nowadays, with the development of digital technology, there is wide useof various types of electronic devices such as a mobile communicationterminal, a smart phone, a tablet personal computer (PC), a notebookcomputer, a personal digital assistant (PDA), a wearable device, or adigital camera.

An electronic device (e.g., a smartphone) may include various electroniccomponents (e.g., receiver, speaker, camera, magnetic sensor, andacceleration sensor) including a magnetic substance for an operationthereof. For example, the receiver may include a coil and a magnet as anactuator of a diaphragm. As another example, the camera may include acoil and a magnet as an actuator for moving a lens. As electroniccomponents including a magnetic substance are mounted in a limited spaceof the electronic device, the electronic components may affect adjacentother electronic components by a magnetic force. For example, electroniccomponents each including a magnetic substance may be disposed adjacentto each other in an inner space of the electronic device: and, in thiscase, the magnetic substances may mutually affect each other; thus, anerror may arise in an operation of the electronic component. Accordingto an embodiment, an error may occur in an operation of other adjacentelectronic components by an influence of a magnetic force radiated fromthe magnetic substance of the electronic component.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providesan electronic device that enables electronic components to operatewithout errors from a magnetic force, even if the electronic componentseach including a magnetic substance are installed adjacent to eachother.

Another aspect of the disclosure is to provide an electronic devicecapable of effectively shielding a magnetic force between two adjacentmagnetic substances therein.

Another aspect of the disclosure is to provide an electronic device thatenables design of a minimum shield structure (magnetic shield member)based on at least a driving method of an electronic component indesigning a shield structure for shielding a magnetic force between twoadjacent magnetic substances therein.

Another aspect of the disclosure is to provide an electronic deviceincluding a shield structure that can increase the magnetic shieldeffect while minimizing a separation distance between electroniccomponents including magnetic substances.

Another aspect of the disclosure is to provide an electronic deviceincluding a shield structure capable of shielding a magnetic forcebetween adjacent magnetic substances by disposing a nonmagnetic materialand a magnetic shield material, which is a magnetic material on acircuit board constructed between electronic components mounted therein.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, an electronic device isprovided. The electronic device includes a first device including afirst magnetic substance, a second device including a second magneticsubstance, and a shield structure configured to shield at least part ofa magnetic force generated between the first magnetic substance and thesecond magnetic substance, wherein the shield structure includes ashield member disposed between the first device and the second deviceand including a property of a magnetic substance, and a connectingmember physically connected to at least part of the shield member andincluding a property of a nonmagnetic substance, wherein at least partof the connecting member is physically connected to a circuit board.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a circuit board, afirst device including a first magnetic substance, a second deviceincluding a second magnetic substance, and a shield structure configuredto shield at least part of a magnetic force generated between the firstmagnetic substance and the second magnetic substance, wherein the shieldstructure includes a shield member disposed between the first device andthe second device and including a property of a magnetic substancecapable of shielding the at least part of the magnetic force, and aconnecting member physically connected to at least part of the shieldmember and fixed to the circuit board, wherein the connecting member hasa property of a nonmagnetic substance magnetically separated from the atleast part of the magnetic force.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a device including amagnetic substance, a circuit board, and a shield structure configuredto shield at least part of a magnetic field generated by the magneticsubstance, wherein the shield structure includes a shield memberdisposed between the device and another device included in theelectronic device and including a property of a ferromagnetic substancecapable of shielding the at least partial magnetic field, and aconnecting member physically connected between the circuit board and atleast part of the shield member, wherein the connecting member has aproperty of a nonmagnetic substance magnetically separated from the atleast partial magnetic field.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a front perspective view illustrating an electronic deviceaccording to various embodiments of the disclosure;

FIG. 2 is a rear perspective view illustrating the electronic device ofFIG. 1 according to an embodiment of the disclosure;

FIG. 3 is an exploded perspective view illustrating the electronicdevice of FIG. 1 according to an embodiment of the disclosure;

FIG. 4 is a plan view illustrating coupling of some components of theelectronic device of FIG. 3 according to an embodiment of thedisclosure;

FIG. 5 is a diagram illustrating a shield structure for shielding amagnetic force from a device including a magnetic substance in anelectronic device according to various embodiments of the disclosure;

FIG. 6 is a plan perspective view illustrating a shield structurecoupled to a circuit board according to various embodiments of thedisclosure;

FIG. 7 is a cut-away perspective view illustrating the shield structuretaken along line B-B′ of FIG. 6 according to an embodiment of thedisclosure;

FIG. 8 is a projection perspective view illustrating a state in whichthe shield structure contacts the circuit board of FIG. 6 according toan embodiment of the disclosure;

FIG. 9 is a rear perspective view illustrating a state in which theshield structure contacts the circuit board of FIG. 6 according to anembodiment of the disclosure;

FIG. 10 is a rear perspective view illustrating another form of a shieldstructure contacting a circuit board according to various embodiments ofthe disclosure;

FIG. 11 is a rear perspective view illustrating another form of a shieldstructure contacting a circuit board according to various embodiments ofthe disclosure;

FIG. 12 is a rear perspective view illustrating another form of a shieldstructure contacting a circuit board according to various embodiments ofthe disclosure;

FIGS. 13 and 14 are diagrams illustrating a shield structure forshielding a magnetic force from a device including a magnetic substancein an electronic device according to various embodiments of thedisclosure;

FIG. 15 is a diagram illustrating an example of a structure in which ashield structure shields a magnetic force between devices according tovarious embodiments of the disclosure;

FIG. 16 is a diagram illustrating an example of a structure in which ashield structure shields a magnetic force between devices according tovarious embodiments of the disclosure; and

FIG. 17 is a diagram illustrating an example of a structure in which ashield structure shields a magnetic force between devices according tovarious embodiments of the disclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

DETAILED DESCRIPTION

The following description reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purpose only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 1 is a front perspective view illustrating an electronic deviceaccording to various embodiments of the disclosure. FIG. 2 is a rearperspective view illustrating the electronic device of FIG. 1 accordingto an embodiment of the disclosure.

Referring to FIGS. 1 and 2 , an electronic device 100 according tovarious embodiments may include a housing 110 including a first plate(or front surface) 110A, a second plate (or rear surface) 110B, and aside surface 110C enclosing a space between the first plate 110A and thesecond plate 110B. According to an embodiment (not illustrated), thehousing 110 may refer to a structure forming part of the first plate110A, the second plate 110B, and the side surface 110C of FIG. 1 .According to an embodiment, the first plate 110A may include a frontplate 102 (e.g., a polymer plate or a glass plate including variouscoating layers) in which at least part is substantially transparent. Thesecond plate 110B may be formed by a substantially opaque rear plate111. The rear plate 111 may be formed with, for example, coating ortinted glass, ceramic, a polymer, a metal (e.g., aluminum, stainlesssteel (STS), or magnesium) or a combination of at least two of thesematerials. The side surface 110C may be formed by a side bezel structure(or “side member”) 118 coupled to the front plate 102 and the rear plate111 and including a metal and/or a polymer. In some embodiments, therear plate 111 and the side bezel structure 118 may be integrally formedand include the same material (e.g., a metal material such as aluminum).

According to an embodiment, the electronic device 100 may include atleast one of a display 101, a microphone hole 103, speaker holes 107, aspeaker hole 114, a first sensor module 104, a second sensor module 119,a first camera device 105, a second camera device 112, a flash 113, ahome key button 115, a touch button 116, a side key button 117, anindicator 106, a first connector hole 108, or a second connector hole109. In some embodiments, the electronic device 100 may omit at leastone of the components or may additionally include other components.

The display 101 may be exposed through, for example, a substantialportion of the front plate 102. The display 101 may be coupled to atouch sensing circuit, a pressure sensor capable of measuring theintensity (pressure) of a touch, and/or a digitizer for detecting astylus pen of a magnetic field method or may be disposed adjacentthereto.

A microphone hole 103, speaker holes 107, and a speaker hole 114 may beincluded. A microphone may be disposed at the microphone hole 103 forobtaining an external sound therein, and in some embodiments, aplurality of microphones may be disposed to detect a direction of asound. One or more speakers may be disposed at the speaker holes 107 foroutputting sound outside the electronic device 100. A speaker may bedisposed at the speaker hole 114 for outputting sound outside theelectronic device 100 to an ear disposed adjacent to the electronicdevice 100. In some embodiments, the speaker holes 107, and speaker hole114, and the microphone hole 103 may be implemented as a single hole ora speaker (e.g., piezo speaker) may be formed without speaker holes 107and the speaker hole 114.

The first sensor module 104 and second sensor module 119 may generate anelectrical signal or a data value corresponding to an operating statewithin the electronic device 100 or an external environment state. Thefirst sensor module 104 may be a proximity sensor and/or a fingerprintsensor disposed at the first plate 110A of the housing 110. The secondsensor module 119 may be a heart rate monitoring (HRM) sensor disposedat the second plate 110B of the housing 110. The fingerprint sensor maybe disposed at the second plate 110B as well as the first plate 110A(e.g., a home key button 115) of the housing 110. The electronic device100 may include a sensor module (not illustrated), for example, at leastone of a gesture sensor, gyro sensor, barometer sensor, magnetic sensor,acceleration sensor, grip sensor, proximity sensor, color sensor (e.g.,red, green, and blue (RGB) sensor), infrared (IR) sensor, bio sensor(medical sensor, biometric sensor), temperature sensor, humidity sensor,or illuminance sensor.

A first camera device 105 disposed at the first plate 110A of theelectronic device 100, a second camera device 112 disposed at the secondplate 110B, and/or a flash 113 may be included. The first camera device105 and the second camera device 112 may include one or more lenses, animage sensor, and/or an image signal processor (ISP). The flash 113 mayinclude, for example, a light emitting diode (LED) or a xenon lamp. Insome embodiments, two or more lenses (wide angle and telephoto lenses)and image sensors may be disposed at one surface of the electronicdevice 100.

A home key button 115 disposed at the first plate 110A of the housing110, a touch button 116 disposed at a periphery of the home key button115, and/or a side key button 117 disposed at the side surface 110C ofthe housing 110 may be included. In another embodiment, the electronicdevice 100 may not include some or all of the above-mentioned home keybutton 115, touch button 116, and side key button 117, and the home keybutton 115, touch button 116, and side key button 117 that are notincluded may be implemented as different forms such as a soft key on thedisplay 101.

The indicator 106 may be disposed at, for example, the first plate 110Aof the housing 110. The indicator 106 may provide, for example, statusinformation of the electronic device 100 in an optical form and includea LED.

The first connector hole 108 may receive a connector (e.g., a universalserial bus (USB) connector) for transmitting and receiving power and/ordata to and from an external electronic device and/or the secondconnector hole 109 may be an earphone jack that may receive a connectorfor transmitting and receiving an audio signal to and from an externalelectronic device.

FIG. 3 is an exploded perspective view illustrating the electronicdevice of FIG. 1 according to an embodiment of the disclosure.

Referring to FIG. 3 , an electronic device 300 may include a side bezelstructure 310, a first support member 311 (e.g., a bracket), a frontplate 320, a display 330, a printed circuit board (PCB) 340, a receiver341 (or speaker), at least one front-facing camera 342 (or selfiecamera), at least one back-facing camera 343, a battery 350, a secondsupport member 360 (e.g., a rear case), an antenna 370, and a rear plate380.

In some embodiments, the first support member 311, the PCB 340, and thesecond support member 360 may form a groove (e.g., fixing groove) forfixing and mounting the receiver 341, the at least one front-facingcamera 342, and the at least one back-facing camera 343; and thereceiver 341, the at least one front-facing camera 342, and the at leastone back-facing camera 343 may be fixed to and mounted in the electronicdevice 300 based on at least the fixing groove of the PCB 340. In someembodiments, the electronic device 300 may omit at least one (e.g., thefirst support member 311, the second support member 360) of thecomponents or may further include other components. At least one of thecomponents of the electronic device 300 may be the same as or similar toat least one of the components of the electronic device 100 of FIGS. 1or 2 , and redundant descriptions are omitted hereinafter.

The first support member 311 may be disposed inside the electronicdevice 300 to be connected to the side bezel structure 310 or may beintegrally formed with the side bezel structure 310. The first supportmember 311 may be made of, for example, a metal material and/or anon-metal (e.g., polymer) material. The display 330 may be coupled toone side of the first support member 311, and the PCB 340 may be coupledto the other side of the first support member 311.

In the PCB 340, a processor, memory, and/or interface may be mounted.The processor may include, for example, at least one of a centralprocessing unit (CPU), application processor (AP), graphic processingunit (GPU), ISP, sensor hub processor, or communication processor (CP).

The memory may include, for example, a volatile memory or a non-volatilememory.

The interface may include, for example, a high definition multimediainterface (HDMI), a USB interface, a secure digital (SD) card interface,and/or an audio interface. The interface may, for example, at least oneof electrically or physically connect the electronic device 300 to anexternal electronic device and include a USB connector, an SDcard/multi-media card (MMC) connector, or an audio connector.

The battery 350 is a device for supplying power to at least onecomponent of the electronic device 300 and may include, for example, anon-rechargeable primary cell (battery), a rechargeable secondary cell(battery), or a fuel cell (battery). At least part of the battery 350may be disposed, for example, substantially flush with the PCB 340. Thebattery 350 may be integrally disposed within the electronic device 300and may be disposed detachably from the electronic device 300.

The antenna 370 may be disposed between the rear plate 380 and thebattery 350. The antenna 370 may include, for example, a near fieldcommunication (NFC) antenna, a wireless charging antenna, and/or amagnetic secure transmission (MST) antenna. The antenna 370 may perform,for example, short-range communication with an external device or maytransmit and receive wirelessly power necessary for charging. In otherembodiments, an antenna element may be formed by part of the firstsupport member 311 and/or the side bezel structure 310 or a combinationthereof.

FIG. 4 is a plan view illustrating coupling of some components of theelectronic device of FIG. 3 according to an embodiment of thedisclosure.

Referring to FIG. 4 illustrates an example of coupling two devices (orelectronic components) that may be mounted in the electronic device 300to a circuit board 430. For example, FIG. 4 illustrates an example of astructure in which a first device 410 (or a first electronic component)and a second device 420 (or a second electronic component) are fixed (orcoupled) to a specified position (e.g., a groove for fixing each of thefirst device 410 and the second device 420) of the circuit board 430 inthe electronic device 300.

In various embodiments, at one side of the circuit board 430, at leastone electronic component may be provided. For example, the circuit board430 may mechanically (or physically) fix the first device 410, thesecond device 420, and various electronic components (e.g., processor,memory, and/or interface) and may be the PCB 340 of FIG. 3 configured toconnect by a circuit (or electrically) based on a circuit design betweenthe respective electronic components.

In various embodiments, each of the first device 410 and the seconddevice 420 may be mounted within a housing (e.g., the side bezelstructure 310) of the electronic device 300 and be an electroniccomponent including a magnetic substance. According to an embodiment,the first device 410 may be an electronic component (e.g., the receiver341 of FIG. 3 ) including the first magnetic substance in the electronicdevice 300. According to an embodiment, the second device 420 may be anelectronic component (e.g., the back-facing camera 343 of FIG. 3 )including a second magnetic substance in the electronic device 300. Invarious embodiments, the devices 410 and 420 may include the foregoingelectronic components and various other electronic components (e.g.,magnetic sensor, acceleration sensor, and speaker) including a magneticsubstance.

According to an embodiment, when the devices 410 and 420 are mountedadjacent to each other in the electronic device 300, magnetic substancesof the devices 410 and 420 may affect each other; thus, an error mayoccur in an operation of the devices 410 and 420. To prevent such anerror, electronic devices are designed to shield a magnetic force with adevice or a shield structure disposed adjacent to the device and made ofa conductive material (e.g., SUS, ferrite).

According to various embodiments, the electronic device 300 may includea shield structure for shielding a magnetic force by a first magneticsubstance or a second magnetic substance between the first device 410including a first magnetic substance and the second device 420 includinga second magnetic substance. Hereinafter, a shield method by a shieldstructure for shielding a magnetic force and a structure thereof will bedescribed in detail.

Hereinafter, in various embodiments, for convenience of description, itis described that the first device (or the first electronic component)and the second device (or the second electronic component) includerespective magnetic substances, but the disclosure is not limitedthereto. For example, in various embodiments, in a structure in whicheither the first device or the second device includes a magneticsubstance and in which the other device does not include a magneticsubstance, the disclosure may be applied to a structure that shields atleast part of a magnetic force generated by the device including themagnetic substance. According to an embodiment, in a structure in whichthe first device includes a magnetic substance and in which the seconddevice does not include a magnetic substance, the disclosure may includea structure that shields at least part of a magnetic force generated bythe magnetic substance of the first device.

FIG. 5 is a diagram illustrating a shield structure for shielding amagnetic force from a device including a magnetic substance in anelectronic device according to various embodiments of the disclosure.

Referring to, FIG. 5 is a diagram schematically illustrating one side ofthe electronic components taken along line A-A′ of FIG. 4 .

Referring to FIG. 5 , an electronic device 500 may include a firstdevice 510 (e.g., the receiver 410 of FIG. 4 ) including a firstmagnetic substance 515, a second device 520 (e.g., the back-facingcamera of FIG. 4 ) including a second magnetic substance 525, a circuitboard 530 (e.g., the PCB 430 of FIG. 4 ), and a shield structure 560 forshielding at least part of a magnetic force generated between the firstmagnetic substance 515 and the second magnetic substance 525. In variousembodiments, the first device 510 and the second device 520 includemagnetic substances 515 and 525, respectively, but the disclosure is notlimited thereto. Therefore, the disclosure may include a structure inwhich any one device (e.g., the first device 510) includes a magneticsubstance (e.g., the first magnetic substance 515) and in which theother device (e.g., the second device 520) does not include a magneticsubstance (e.g., the second magnetic substance 525). For example, invarious embodiments, the disclosure may include a structure in which atleast part of a magnetic force generated by the first magnetic substance515 of the first device 510 is shielded not to affect the second device520 that does not include a magnetic substance.

According to an embodiment, the shield structure 560 may include amagnetic force shield member (or shield portion) 540 for shielding amagnetic force and a connecting member (or connection portion) 550 forphysically fixing the shield member 540 to the circuit board 530.

In various embodiments, the shield member 540 may be disposed betweenthe first device 510 and the second device 520. The shield member 540may be made of a shield material (or a first material metal or amagnetic material) capable of shielding at least part of a magneticforce generated between the first magnetic substance 515 and the secondmagnetic substance 525. According to an embodiment, the shield materialmay be a material (metal) including the property of a ferromagneticmaterial. For example, the shield material may be implemented with SUS(e.g., an element such as iron (Fe), cobalt (Co), and nickel (Ni) or analloy).

In various embodiments, the connecting member 550 may contact (orphysically connected to) at least part of the shield member 540 based ona portion of one side thereof and may contact (or physically connectedto) and be fixed to the circuit board 530 based on the other sidethereof. The connection member 550 may be made of a nonmagnetic material(or a second material metal) that may be magnetically separated from atleast part of a magnetic force generated between the first magneticsubstance 515 and the second magnetic substance 525. According to anembodiment, the nonmagnetic material may be a material (metal) that isnot affected by a magnetic field formed by a magnetic substance (e.g.,magnet). For example, the nonmagnetic material may be implemented usingnickel silver (or pure iron).

In various embodiments, the shield structure 560 (e.g., the shieldmember 540, the connecting member 550) may be disposed (e.g., formed ina surface mount device (SMD) method) at the circuit board 530 in aparticular manner to contact the circuit board 530. According to anembodiment, in implementing the shield structure 560, the shieldstructure 560 may be divided into the shield member 540 (e.g., materialfor magnetic field absorption (e.g., magnetic material)) for shielding amagnetic force and the connecting member 550 (e.g., non-magnetizedmaterial (e.g., nonmagnetic material), and a shield structure may beimplemented by joining two materials (e.g., the shield member 540 andthe connecting member 550). In the case of a shield structure accordingto various embodiments, the nonmagnetic material (e.g., the connectingmember 550) formed with an SMD method may be designed to secure only aminimum area to be formed with an SMD method, thereby more freelydesigning a contact structure and/or position between the device (or amagnetic substance of the device) and the circuit board 530.

According to various embodiments, a disposition position (e.g., aposition adjacent to any one device) of the shield member 540 may bedetermined according to whether functional characteristics (or driving(operation) method) of the device (e.g., the first device 510, thesecond device 520) are affected by a magnet (or magnetic force, magneticfield) between the first device 510 and the second device 520. Accordingto an embodiment, the shield member 540 may be disposed closer (orleaned) to any one device (e.g., the first device 510 including amagnetic substance that affects an operation of another device) based onat least the functional characteristics of the first device 510 and thesecond device 520. According to an embodiment, the shield member 540 mayhave different structures in a distance and/or thickness from that of adevice in which a disposition position is determined so as to correspondto the intensity (or magnetic force) of each magnetic substance betweenthe first magnetic substance 515 and the second magnetic substance 525.

According to an embodiment, magnetic fluxes emitted from each of themagnetic substances (e.g., the first magnetic substance 515, the secondmagnetic substance 525) of electronic components (e.g., the first device510 and the second device 520) of the electronic device 500 may bedifferent in intensity thereof. For example, the first magneticsubstance 515 provided in the first device 510 may have strongermagnetic properties than the second magnetic substance 525 provided inthe second device 520. Further, the device may have a second drivingmethod (or driving function) (e.g., an auto focus (AF) function of acamera, a zoom in/out function) affected by a magnetic flux of amagnetic substance of another device or the device may have a firstdrive method (e.g., a device that is not affected by other magneticfluxes in driving, such as a speaker) that is not affected by a magneticflux of a magnetic substance of another device. In an embodiment, adevice including a first driving method and/or relatively strongmagnetism may be referred to as a first device 510 and a deviceincluding a second driving method and/or relatively weak magnetism maybe referred to as a second device 520.

According to an embodiment, a magnetic flux emitted from the secondmagnetic substance 525 of the second device 520 may not significantlyaffect an operation of the first device 510, but a magnetic flux emittedfrom the first magnetic substance 515 of the first device 510 may causea serious error in an operation of the second device 520. According toan embodiment, the shield member 540 may absorb a magnetic force of thefirst magnetic substance 515 of the first device 510 to form a magneticfield with the first magnetic substance 515. Therefore, when a length Bbetween the shield member 540 and the second device 520 (or the secondmagnetic substance 525 of the second device 520) is short (or as theshield member 540 and the second device 520 are disposed adjacent toeach other, when the shield member 540 and the second device 520 belongto a magnetic field range), a magnetic flux emitted through the shieldmember 540 may affect an operation of the second device 520.

Therefore, the shield structure 560 of the electronic device 500according to various embodiments may be disposed adjacent to a device ofa first driving method and/or a device (e.g., the first device 510) thatemits a relatively strong magnetic flux among the first device 510 andthe second device 520.

According to an embodiment, as illustrated in FIG. 5 , the shieldstructure 560 (in particular, the shield member 540) may be disposedcloser to the first device 510 rather than the second device 520.Thereby, even within a fixed (or limited) length A between the firstdevice 510 and the second device 520, a separation distance (e.g.,length B) between the shield member 540 and the second magneticsubstance 525 (e.g., a magnetic substance to be unshielded that may beaffected by a magnetic force) may be maximally secured (e.g., maximumseparation distance). According to an embodiment, a distance (e.g.,length A) between the first device 510 and the second device 520 mayinclude a first radius (e.g., about 15 mm, about 20 mm), and a distance(e.g., length B) between the shield member 540 and the second magneticsubstance 525 may include a second radius (e.g., about 10 mm, about 15mm) smaller than the first radius.

Hereinafter, a structure of the shield structure 560 for shielding amagnetic force in the electronic device 500 according to variousembodiments will be described in detail. In the following description,for convenience of description, it is described that the first device510 and the second device 520 each include a magnetic substance, but ina structure in which only the first device 510 includes a magneticsubstance and in which the second device 520 does not include a magneticsubstance, the electronic device 500 may include a structure thatshields at least part of a magnetic force generated by the magneticsubstance of the first device 510.

FIGS. 6, 7, 8, and 9 are diagrams illustrating a structure for shieldinga magnetic force from a device including a magnetic substance in anelectronic device according to various embodiments of the disclosure.

Referring to, FIG. 6 is a plan perspective view illustrating an examplein which the shield structure 560 (e.g., the shield member 540, theconnecting member 550) is disposed between two devices (e.g., the firstdevice 510, the second device 520) and contacts (or is coupled to) thecircuit board 530. FIG. 7 is a cut-away perspective view taken alongline B-B′ of FIG. 6 . FIG. 8 is a diagram illustrating a projectionperspective view illustrating a form in which the shield structure 560contacts (or is connected to) the circuit board 530 in FIG. 6 . FIG. 9is a rear perspective view illustrating a form in which the shieldstructure 560 contacts the circuit board 530 in FIG. 6 .

A contact (connection) structure of the shield structure 560 and thecircuit board 530 will be described with reference to FIG. 6 .

Referring to FIG. 6 , the first device 510 is an electronic componentincluding the first magnetic substance 515; and, in an embodiment, thefirst device 510 may correspond to a receiver or a speaker. The seconddevice 520 is an electronic component including the second magneticsubstance 525; and, in an embodiment, the second device 520 maycorrespond to a camera. In various embodiments, the device maycorrespond to various electronic components (e.g., a magnetic sensor, anacceleration sensor) including a magnetic substance in addition to theabove-described electronic components.

According to an embodiment, when at least two devices (e.g., the firstdevice 510 and the second device 520) are mounted adjacent to each otherin the electronic device 500, at least two magnetic substances (e.g.,the first magnetic substance 515 and the second magnetic substance 525)of the devices 510 and 520 may affect the other device in any onedirection or the other device in both directions. Accordingly, an errormay occur in an operation of the devices 510 and 520. To prevent such anerror, the shield member (e.g., the shield members 540 of FIGS. 6 to 9 )made of a conductive material (e.g., SUS, ferrite) may be disposedbetween the devices 510 and 520.

According to an embodiment, the circuit board 530 may form a firstgroove 630 in which one end (e.g., a first member (or a firstreinforcing member) 610 of a connecting member (e.g., a connectingmember 550 of FIGS. 6 to 9 ) may contact one side (e.g., the left sideof the circuit board 530 in a viewing direction of FIG. 6 ) thereof anda second groove 640 in which the other end (e.g., a second member (orsecond reinforcing member) 620 of the connecting member 550 may contactthe other side (the right side surface of the circuit board 530 in aviewing direction of FIG. 6 ) of an opposite direction of one side.

According to an embodiment, the first groove 630 and the second groove640 may have a structure including a width of different sizes. Forexample, the first groove 630 and the second groove 640 may be formed ina structure corresponding to one end (e.g., the first reinforcing member610) and the other end (e.g., the second member 620) of the contactconnecting member 550. According to an embodiment, the first groove 630may have a width (e.g., a width at which the first reinforcing member610 may be seated) corresponding to one end (e.g., the first reinforcingmember 610) of the connecting member 550, and the second groove 640 mayhave a width (e.g., a width at which the second reinforcing member 620may be seated) corresponding to the other end (e.g., the secondreinforcing member 620) of the connecting member 550. For example, inFIGS. 6 to 9 , the first groove 630 may be relatively smaller than thesecond groove 640, and the second groove 640 may have a relativelylarger width than that of the first groove 630. According to someembodiments, the circuit board 530 may not have the first groove 630 andthe second groove 640 and may have a structure that contacts (or adheresto) the connecting member 550 through a lower surface of the circuitboard 530.

A structure of the shield structure 560 will be described with referenceto FIGS. 6 to 9 .

The shield structure 560 may include a shield member 540 including amagnetic property and a connecting member 550 including a nonmagneticproperty. According to an embodiment, the shield structure 560 mayinclude a shield member 540 (e.g., a magnetic substance) for shielding amagnetic force and a connecting member 550 for fixing the shield member540 to the circuit board 530. According to an embodiment, the shieldstructure 560 may be made of a heterogeneous material such as the shieldmember 540, which is a magnetic substance, and the connecting member550, which is a nonmagnetic substance; and the heterogeneous materialsare bonded to the circuit board 530 by an SMD method. For example, theshield member 540 may have a property of a ferromagnetic substancecapable of shielding a magnetic force, and the connecting member 550 mayhave a property of a nonmagnetic substance that may be magneticallyseparated from a magnetic force.

Referring to FIG. 7 , the shield member 540 may have a plate-likestructure and may contact (physically fixed to) one side of the circuitboard 530 through the connecting member 550. According to an embodiment,the shield member 540 may have a bending structure including a firstbending portion 740 (e.g., an upper portion in a longitudinal directionin the drawing) and/or a second bending portion (e.g., a lower portionin a longitudinal direction in the drawing). For example, the shieldmember 540 may be at least partially bent.

According to an embodiment, the bending portion (e.g., the first bendingportion 740) of the shield member 540 may have a shape bent in apredetermined direction. According to an embodiment, a bending structureof the shield member 540 may be designed in a shape “¬” or a shape “∟”by bending an upper side portion or a lower side portion or may bedesigned in a shape “⊏” by bending an upper side portion and a lowerside portion. For example, the number of bending portions of the shieldmember 540 may be plural. FIGS. 6 to 9 illustrate an example in which anupper portion of the shield member 540 is designed in a bendingstructure.

According to an embodiment, the bending portion (e.g., the first bendingportion 740) bent in the shield member 540 may be formed in an outwarddirection of the circuit board 530, for example, in a direction of adevice (or magnetic substance of the device) to be shielded. Accordingto an embodiment, a bending angle and a bending direction of the bendingportion may be variously implemented according to the magnitude(magnetic force) and/or a size (e.g., height) of the magnetic substanceto be shielded. According to an embodiment, the shield member 540 maynot include a bending portion or may be bent in a predetermined angle(e.g., 90°, 120°, 150°) (or radius of curvature). According to anembodiment, an entire height (or length) and/or area of the shieldmember 540 may be the same as or relatively larger than a size (e.g.,height and/or area) of the magnetic substance to be shielded. Thereby,larger effects can be expected in formation of a magnetic field with themagnetic substance to be shielded and shielding of a magnetic force.

According to an embodiment, the shield member 540 may be designed tohave a variable thickness according to a magnetic force of a magneticsubstance to be shielded. For example, the shield member 540 may bedesigned in a thickness to sufficiently absorb magnetism of the magneticsubstance to be shielded. According to an embodiment, the shield member540 may have a thickness of about 0.15 mm.

According to an embodiment, the shield member 540 may contact (beconnected to) the circuit board 530 in an SMD method based on theconnecting member 550.

Referring to FIGS. 7, 8, and 9 , at one side (e.g., an upper side) ofthe circuit board 530, at least one electronic component may beprovided, and the connecting member 550 contacts the other side (a lowersurface 655) of the circuit board 530. According to an embodiment, theconnecting member 550 may have a shape that encloses the circuit board530 in a concave (“

”) shape (or “U” shape) structure. According to an embodiment, theconnecting member 550 may contact fixing grooves (e.g., the first groove630, the second groove 640) of both sides (e.g., a portion 635 of theleft side and a portion 645 of the right side) of the circuit board 530and a portion of the lower surface 655 of the circuit board 530.

According to an embodiment, the connecting member 550 may be, forexample, a reinforcing member formed with a plurality of portions (e.g.,a first portion, a second portion, and a third portion) dividedaccording to a shape and/or function thereof. According to anembodiment, the connecting member 550 may be divided into a firstreinforcing member 710 (e.g., vertical member, bar member) that is afirst portion of the reinforcing member and for fixing to the firstgroove 630 of one side of the circuit board 530, a second reinforcingmember 720 that is a second portion of the reinforcing member and forfixing to the circuit board 530 through the second groove 640 of theother side of the circuit board 530, or a third reinforcing member 730(e.g., a bottom member) that is a third portion of the reinforcingmember and that contacts the lower surface 655 of the circuit board 530.

According to an embodiment, the first reinforcement member 710 (e.g., afirst portion of the reinforcement member) and the second reinforcementmember 720 (e.g., a second portion of the reinforcement member) may befixed vertically to both sides of the third reinforcing member 730(e.g., a third portion of the reinforcement member). For example, theconnecting member 550 may be formed such that the first portion (firstregion) is disposed to correspond to the first groove 630 of the circuitboard 530, the second portion (second region) is disposed to correspondto the second groove 640 of the circuit board 530, and a third portion(third region) contacts a lower surface of the circuit board 530.According to an embodiment, the connecting member 550 may be formed suchthat the first reinforcing member 710 (e.g., the first portion of thereinforcing member), the second reinforcing member 720 (e.g., the secondportion of the reinforcing member), and the third reinforcing member 730(e.g., the third portion of the reinforcing member) each have differentfunctions (or have different shapes).

According to an embodiment, in the connecting member 550, one surface810 (e.g., an inner surface) of the first reinforcing member 710 of oneend may contact the first groove 630 of the circuit board 530, and atleast one surface 820 (e.g., a partial area of the inner surface side)of the second reinforcing member 720 of the other end may contact thesecond groove 640 of the circuit board 530. According to an embodiment,the shield member 540 may contact the entirety of the other surface 830(e.g., outer surface) of the second reinforcing member 720. For example,one side of the connecting member 550 may contact the other surface 830of the second reinforcing member 720.

According to an embodiment, the first reinforcement member 710 and thesecond reinforcement member 720 may have different widths and lengths(or heights). According to an embodiment, in FIGS. 6 to 9 , the firstreinforcing member 710 may have relatively smaller width and length thanthe second reinforcing member 720, and the second reinforcing member 720may have a relatively larger width and length (e.g., a structureincluding a wide width and a long length) than the first reinforcingmember 710. For example, the second reinforcing member 720 may contactin a larger area in consideration of bending prevention and contactforce of the shield member 540.

According to an embodiment, the first reinforcement member 710 may havea height corresponding to (or equal to) a height of the circuit board530 (e.g., an upper surface of the circuit board 530). The secondreinforcing member 720 may protrude in a height higher than that of thecircuit board 530 (e.g., a structure protruding from an upper surface ofthe circuit board 530). For example, the second reinforcing member 720may have a relatively larger area than the first reinforcing member 710in consideration of a contact area with the shield member 540. Throughsuch a structure shape, one side (e.g., the inner side) of the secondreinforcing member 720 may be fixed to and contact the circuit board530, and the other side (e.g., the outer side) thereof may be morestably fixed to and contact the shield member 540.

According to an embodiment, the third reinforcing member 730 may have ashape in which the entire upper surface 830 (or the inner surface)contacts the circuit board 530.

FIGS. 10 to 14 illustrate various embodiments of a shield structureaccording to various embodiments of the disclosure. According to anembodiment, a circuit board (e.g., PCB) may have a relatively smallwidth w between (e.g., a weak part) at least two devices (e.g., a firstdevice, a second device) and may be more easily damaged than otherportions of the circuit board. In various embodiments, a shieldstructure (e.g., shield member, connecting member) may reinforce anarrowly formed portion (e.g., a weak part) between the devices.According to an embodiment, in the circuit board, a shield structure maybe disposed in a portion that may benefit from reinforcement (e.g., aweak part), and the shield structure may reinforce the weak part basedon an elongated plate-like structure or a bending structure bent in apredetermined angle (e.g., about 90°). According to an embodiment, theconnecting member of the shield structure may function as a member forreinforcing strength.

FIG. 10 is a rear perspective view illustrating another form of a shieldstructure contacting a circuit board according to various embodiments ofthe disclosure.

FIG. 10 illustrates another form of the shield structure 560 (e.g., theshield member 540 and the connecting member 550) described in theforegoing description with reference to FIGS. 5 to 9 . According to anembodiment, as illustrated in FIG. 10 , a shield structure 1060 (e.g., ashield member 1040, a connecting member 1050) may have a shape (orstructure) corresponding to the shield structure 560 according to theforegoing example and further have a function (e.g., a member forreinforcing strength) for reinforcing strength of the circuit board 1030using the connecting member 1050.

Referring to FIG. 10 , in a circuit board 1030, one end and the otherend of the connecting member 1050 may contact through one side of acircuit board 1030 between at least two devices (e.g., a first device(not illustrated), a second device (not illustrated)) and the other sideof an opposite direction of one side. According to an embodiment, thecircuit board 1030 may further have grooves (e.g., the first groove 630of FIG. 6 , the second groove 640 of FIG. 6 ) for fixing the connectingmember 1050 to at least one of one side or the other side. According toan embodiment, FIG. 10 illustrates an example in which a groove isformed in which one end (e.g., a first member 1010) of the connectingmember 1050 may contact any one side (e.g., the left side of the circuitboard 1030 in a viewing direction of FIG. 10 ) of the circuit board1030.

According to an embodiment, the shield member 1040 of the shieldstructure 1060 may correspond to the description of the shield member540 described with reference to FIGS. 5 to 9 , and a detaileddescription thereof will be omitted.

According to an embodiment, the connecting member 1050 of the shieldstructure 1060 may be extended longer than the connecting member 550described with reference to FIGS. 5 to 9 to have a length (or width)longer than the connecting member 550. According to an embodiment, inthe circuit board 1030, a portion (hereinafter, weak part) between twodevices (e.g., a first device (not illustrated), a second device (notillustrated)) may have relatively weaker strength than that of otherportions of the circuit board 1030 because of a narrow width w. Invarious embodiments, the connecting member 1050 of the shield structure1060 may be used as a reinforcing member for reinforcing strength of theweak part of the circuit board 1030. For example, the connecting member1050 may function as a member for reinforcing strength.

According to an embodiment, as illustrated in FIG. 10 , the connectingmember 1050 may be elongated in a direction corresponding to alongitudinal direction of a weak part of the circuit board 1030 to havea shape that covers at least part (e.g., all or some) of the weak part.As illustrated in FIG. 10 , in the circuit board 1030, the connectingmember 1050 may be formed inward (e.g., a shape in which the weak partand the connecting member 1050 have a step) by a width of a groove 1015in which one end (e.g., the first member 1010) thereof may contact tohave a width w′ smaller than a width w of the weak part. According to anembodiment, a length of the connecting member 1050 may correspond tothat of the weak part or may be shorter or longer than that of the weakpart according to a fastening structure of the connecting member 1050.According to an embodiment, the connecting member 1050 may have a shapecorresponding to that of the weak part.

According to various embodiments, the connecting member 1050 may bedisposed in the circuit board 1030 in a specific manner (e.g., formed ina SMD method) to contact the circuit board 1030. In the case of a shieldstructure according to various embodiments, the nonmagnetic material(e.g., the connecting member 1050) formed with an SMD method may bedesigned to secure a maximum area (or larger area) to be formed with anSMD method, thereby reinforcing strength of the weak part between thedevice and the device in the circuit board 1030.

FIG. 11 is a rear perspective view illustrating another form of a shieldstructure contacting a circuit board according to various embodiments ofthe disclosure.

FIG. 11 illustrates another form of the shield structure 1060 describedwith reference to FIG. 10 . For example, FIG. 11 illustrates an exampleof another structure of a connecting member 1150 of a shield structure1160.

Referring to FIG. 11 , in a circuit board 1130, one end and the otherend of the connecting member 1150 may contact through one side of thecircuit board 1130 between at least two devices (e.g., a first device(not illustrated), a second device (not illustrated)) and the otherside, respectively of opposite side of the one side. According to anembodiment, FIG. 11 illustrates an example of a structure in which thecircuit board 1130 contacts the connecting member 1150 through one sideand the other side without forming grooves in one side and the otherside.

According to an embodiment, a shield member 1140 of the shield structure1160 may correspond to that described with reference to FIGS. 5 to 10 ,and a detailed description thereof will be omitted.

According to an embodiment, the connecting member 1150 of the shieldstructure 1160 has an extended width further than that of the connectingmember 1050 described with reference to FIG. 10 , and a first member1110 contacting any one side (e.g., the left side of the circuit board1130 in a viewing direction of FIG. 11 ) of the circuit board 1130 mayhave a length corresponding to that of the connecting member 1050.According to an embodiment, the connecting member 1150 may have anextended length by a height of the side surface of the circuit board1130 at one end of the weak part of the circuit board 1130. According toan embodiment, the first member 1110 may have a structure in which anextended portion of the connecting member 1150 is bent at the end (oredge portion) of a width w of the weak part.

According to an embodiment, as illustrated in FIG. 11 , the connectingmember 1150 may have a length corresponding to that of the weak part ofthe circuit board 1130 and have a width corresponding to a width w ofthe weak part to be formed in a shape (or covering an entire weak part)including an area corresponding to the weak part.

FIG. 12 is a rear perspective view illustrating another form of a shieldstructure contacting a circuit board according to various embodiments ofthe disclosure.

FIG. 12 illustrates another form of the shield structure 1160 describedwith reference to FIG. 11 . For example, FIG. 12 illustrates an exampleof another structure of a connecting member 1250 of a shield structure1260.

Referring to FIG. 12 , a circuit board 1230 may include at least onecircuit terminal (or contact portion) (e.g., GND terminal) related to atleast one device (e.g., a first device (not illustrated), a seconddevice (not illustrated)). According to an embodiment, the circuit board1230 may include a circuit terminal for electrical connection of aparticular device (e.g., a speaker) in the weak part. FIG. 12illustrates an example in which a hole 1203 for electrical wiringconnection is formed at a position corresponding to a circuit terminalformed in a weak part in the connecting member 1250.

According to an embodiment, a shield member 1240 of the shield structure1260 may correspond to that described with reference to FIGS. 5 to 10 ,and a detailed description thereof will be omitted.

According to an embodiment, FIG. 12 illustrates an example in which twocircuit terminals (e.g., GND terminals) for electrical connection with adevice are formed in the weak part of the circuit board 1230. Accordingto an embodiment, the connecting member 1250 may have two holes 1203 atpositions corresponding to each position of the circuit terminals.According to an embodiment, a connection wiring from the device may beconnected to circuit terminals of the circuit board 1230 exposed throughtwo holes 1203 of the connecting member 1250. According to anembodiment, as illustrated in FIG. 12 , when an area of the connectingmember 1250 decreases in order to avoid a circuit terminal, asillustrated in FIGS. 11 or 12 , a first member 1210 of the connectingmember 1250 is extended by a height of the circuit board 1230 (or theweak part) and a portion (e.g., the first member 1210) extended by theheight is bent at the end in the width direction of the weak part,thereby reinforcing strength of the weak part.

FIGS. 13 and 14 are diagrams illustrating a shield structure forshielding a magnetic force from a device including a magnetic substancein an electronic device according to various embodiments of thedisclosure.

Referring to, FIG. 13 is a diagram schematically illustrating one sideof electronic components cut in any one direction in a state in whichthe device is seated in FIGS. 10 to 12 .

Referring to FIG. 13 , an electronic device 1300 may include a firstdevice 1301 (e.g., the receiver 410 of FIG. 4 ) including a magneticsubstance 1305, a second device 1302 (e.g., the second device 420 ofFIG. 4 ) that does not include a magnetic substance, a circuit board1330 (e.g., the PCB 430 of FIG. 4 ), and a shield structure 1360 forshielding at least part of a magnetic force generated between the firstdevice 1301 and the second device 1302. In various embodiments, thefirst device 1301 includes a magnetic substance 1305, but the disclosureis not limited thereto. According to various embodiments, the firstdevice 1301 and the second device 1302 each may include a structureincluding a magnetic substance. For example, the electronic device 1300of the disclosure may include a structure in which one device (e.g., thefirst device 1301) includes a magnetic substance, and the other device(e.g., the second device 1302) does not include a magnetic material, ora structure in which one device and at least one other device eachinclude a magnetic substance.

In various embodiments, the electronic device 1300 may include astructure in which at least part of a magnetic force generated by themagnetic substance 1305 of the first device 1301 is shielded so as notto affect at least one second device 1302 affected by the magneticsubstance 1305.

According to an embodiment, the shield structure 1360 may include ashield member 1340 for shielding a magnetic force and a connectingmember 1350 for physically fixing the shield member 1340 to the circuitboard 1330.

In various embodiments, the shield member 1340 may be disposed betweenthe first device 1301 and the second device 1302. The shield member 1340may be made of a shield material (or first material metal or magneticmaterial) capable of shielding at least part of a magnetic force betweenthe first device 1301 (or the magnetic substance 1305 of the firstdevice 1301) and the second device 1302. According to an embodiment, theshield material may be a material (metal) including a property of aferromagnetic material. For example, the shield material may beimplemented with SUS (e.g., made of an element or alloy such as iron(Fe), cobalt (Co), and nickel (Ni)).

In various embodiments, the connection member 1350 may contact (or bephysically connected to) at least part of the shield member 1340 basedon a portion of one side (e.g., the outer side) and may contact (or bephysically connected to) the circuit board 1330 based on the other side(e.g., the inner side). According to an embodiment, the connectingmember 1350 may be made of a nonmagnetic material (or a second materialmetal) that may be magnetically separated from at least part of amagnetic force generated between the first device 1301 (or the magneticsubstance 1305 of the first device 1301) and the second device 1302.According to an embodiment, the nonmagnetic material may be a material(metal) that is not affected by a magnetic field formed by the magneticsubstance (e.g., magnet). For example, the nonmagnetic material may beimplemented using nickel silver (or pure iron).

According to various embodiments, the shield structure 1360 (e.g., theshield member 1340, the connecting member 1350) may be disposed (e.g.,formed with an SMD method) in the circuit board 1330 in a particularmanner to contact the circuit board 1330. According to an embodiment, inimplementing the shield structure 1360, the shield member 1340 (e.g., amaterial for absorbing a magnetic field (e.g., magnetic material) forshielding a magnetic force and the connecting member 1350 (e.g.,non-magnetized material (e.g., nonmagnetic material)) may be divided andby bonding between two materials (e.g., the shield member 1340 and theconnecting member 1350), a shield structure may be implemented. In thecase of a shield structure according to an embodiment, a nonmagneticmaterial (e.g., the connecting member 1350) to be formed with an SMDmethod may be designed to secure a minimum area to be formed with an SMDmethod; thus, a contact structure and/or position between the device (orthe magnetic substance of the device) and the circuit board 1330 may bemore freely designed. In the case of a shield structure according to anembodiment, a nonmagnetic material (e.g., the connecting member 1350) beformed with an SMD method may be designed to secure a maximum area(e.g., a junction area to be formed with an SMD method in the circuitboard 1330) to be formed with an SMD method. Thereby, in variousembodiments, the strength of a weak part of the circuit board 1330 maybe reinforced (e.g., twist is reinforced), and the connecting member1350 may be bonded to the circuit board 1330 in a larger area to preventfrom separation from the circuit board 1330 of the shield structure1360.

According to various embodiments, a disposition position (e.g., aposition adjacent to a device of any one side) of the shield member 1340may be determined according to whether functional characteristics (ordriving (operation) method) of the device (e.g., the first device 1301,the second device 1302) are affected by a magnet (or magnetic force ormagnetic field) between the first device 1301 and the second device1302. According to an embodiment, the shield member 1340 may be disposedcloser (or leaned) to any one device (e.g., the first device 1301including a magnetic substance that affects an operation of the otherdevice) based on at least functional characteristics of the first device1301 and the second device 1302. According to an embodiment, the shieldmember 1340 may have a distance and/or thickness different from thedevice in which the disposition position is determined to correspond tothe magnitude (or magnetic force) of the magnetic substance between themagnetic substance 1305 of the first device 1301 and the second device1302 (or a magnetic substance (not illustrated) of the second device1302).

The shield structure 1360 of the electronic device 1300 according tovarious embodiments may be disposed adjacent to a device (e.g., thefirst device 1301) that emits a relatively strong magnetic flux amongthe devices 1301 and 1302. According to an embodiment, as illustrated inFIG. 13 , the shield structure 1360 (in particular, the shield member1340) may be disposed closer to the first device 1301 rather than thesecond device 1302.

According to various embodiments, the shield member 1340 may have aplate-like structure and may contact (be physically fixed) on one sideof the circuit board 1330 through the connecting member 1350. Accordingto an embodiment, the shield member 1340 may form at least one end ofboth ends (e.g., an upper or lower portion in a length (or height)direction in the drawing) in a bending structure. For example, theshield member 1340 may be at least partly bent.

According to an embodiment, a bending portion of the shield member 1340may have a shape bent in a predetermined direction. According to anembodiment, a bending structure of the shield member 1340 may bedesigned in a shape “¬” or “∟” by bending of an upper portion or a lowerportion or may be designed in a shape “⊏” by bending of an upper portionor a lower portion. For example, the number of bending portions of theshield member 1340 may be plural. According to an embodiment, the shieldmember 1340 may not include a bending portion and may be formed in aplate-like structure (or a flat plate structure, or a shape “—”), asillustrated in FIG. 13 .

According to an embodiment, an entire height (or length) and/or area ofthe shield member 1340 may be equal to or relatively larger than a size(e.g., height and/or area) of a magnetic substance to be shielded.Thereby, larger effects may be expected on magnetic field formation andmagnetic force shielding with the magnetic substance to be shielded.

According to an embodiment, the shield member 1340 may be designed tohave a variable thickness according to a magnetic force of the magneticsubstance to be shielded. For example, a thickness of the shield member1340 may be designed in a thickness to fully absorb magnetism of themagnetic substance to be shielded. According to an embodiment, theshield member 1340 may have a thickness of about 0.15 mm. According toan embodiment, the shield member 1340 may contact (be connected to) thecircuit board 1330 in an SMD method based on the connecting member 1350.

According to various embodiments, at one side (e.g., an upper side inthe drawing) of the circuit board 1330, at least one electroniccomponent may be provided, and the connecting member 1350 may contactthe other side (e.g., a lower side in the drawing) of the circuit board1330.

According to an embodiment, as at least part of the circuit board 1330has a narrow width w between the first device 1301 and the second device1302, the circuit board 1330 may include a portion (e.g., weak part)including relatively weak strength. In various embodiments, theconnecting member 1350 of the shield structure 1360 may be used as areinforcing member for reinforcing strength of the weak part of thecircuit board 1330. For example, the connecting member 1350 may functionas a member for reinforcing strength. According to an embodiment, theconnecting member 1350 of the shield structure 1360 may enclose the weakpart to correspond to the width w of the weak part. According to anembodiment, the connecting member 1350 may have a shape that enclosesthe circuit board 1330 (e.g., the weak part of the circuit board 1330)in a “concave” shape (or shape “⊏”) structure. According to anembodiment, the connecting member 1350 may contact both sides (e.g., atleast part of the left side, at least part of the right side) of thecircuit board 1330 or at least one of a fixing groove of both sides or alower surface of the circuit board 1330. According to an embodiment, theconnecting member 1350 may have a shape of a bending structure of ashape “¬” (or shape “∟” in a viewing direction).

According to an embodiment, the connecting member 1350 may be areinforcing member formed with a plurality of portions (e.g., a firstportion, a second portion, and a third portion) divided according to ashape and/or function thereof. According to an embodiment, theconnecting member 1350 may be divided into a first reinforcing member(e.g., a vertical member, a rod member) that is a first portion of areinforcing member and for fixing to the first side (e.g., a groove of aleft side surface or a left side surface of the weak part of the circuitboard 1330 in a viewing direction of FIG. 13 ) of the circuit board1330, a second reinforcing member 1352 that is a second portion of areinforcing member and for fixing to the circuit board 1330 through thesecond side (e.g., a groove of a right side surface or a right sidesurface of the weak part of the circuit board 1330 in a viewingdirection of FIG. 13 ) of the circuit board 1330, or a third reinforcingmember 1353 (e.g., a bottom member) that is a third portion of thereinforcing member and contacting a lower surface of the circuit board1330.

According to an embodiment, a first reinforcement member 1351 (e.g., afirst portion of the reinforcement member) and the second reinforcementmember 1352 (e.g., a second portion of the reinforcement member) may befixed vertically to both sides of the third reinforcing member 1353(e.g., a third portion of the reinforcing member). For example, theconnecting member 1350 may be formed so that a first portion (firstregion) is disposed to correspond to the first surface (e.g., the leftside in the drawing) of the circuit board 1330 and that the secondportion (second region) is disposed to correspond to the second surface(e.g., the right side in the drawing) of the circuit board 1330 and thatthe third portion (third region) contacts a lower surface of the circuitboard 1330. According to an embodiment, the connecting member 1350 maybe formed so that the first reinforcing member 1351 (e.g., a firstportion of the reinforcing member), the second reinforcing member 1352(e.g., a second portion of the reinforcing member), or the thirdreinforcement member 1353 (e.g., a third portion of the reinforcementmember) has a different function (or has different shapes).

According to an embodiment, in the connecting member 1350, one surface(e.g., inner surface) of the first reinforcing member 1351 of one endthereof may contact the first surface of the circuit board 1330 and atleast one surface (e.g., a partial area of the inner surface side) ofthe second reinforcing member 1352 of the other end thereof may contactthe second surface of the circuit board 1330. According to anembodiment, the shield member 1340 may contact the other surface (e.g.,the outer surface) of the second reinforcing member 1352.

According to an embodiment, the first reinforcing member 1351 and thesecond reinforcing member 1352 may be formed in a structure including asize corresponding to each other or a width or a length (or height) ofdifferent sizes. According to an embodiment, the second reinforcingmember 1352 may have a relatively smaller width and length than thefirst reinforcing member 1351, and the first reinforcing member 1351 mayhave a structure (e.g., a structure including a wide width and a longlength) including a relatively larger width and length than that of thesecond reinforcing member 1352. For example, the first reinforcingmember 1351 may contact the shield member 1340 in a larger area inconsideration of bending prevention and contact force of the shieldmember 1340.

According to an embodiment, the second reinforcement member 1352 mayhave a height corresponding to (or equal to) a height (e.g., up to anupper surface of the circuit board 1330) of the circuit board 1330(e.g., weak part). The first reinforcing member 1351 may protrude to aheight higher than that of the circuit board 1330 (e.g., a structureprotruded further than the upper surface of the circuit board 1330).According to an embodiment, the third reinforcing member 1353 may have ashape in which an entire upper surface (or inner surface) thereofcontacts the circuit board 1330 (e.g., the weak part of the circuitboard 1330).

According to an embodiment, the connecting member 1350 may have a shapethat encloses a weak part of the circuit board 1330 in a concave shape(or shape “⊏”) structure based on an integral shape of the firstreinforcing member 1351, the second reinforcing member 1352, and thethird reinforcing member 1353. According to an embodiment, theconnecting member 1350 may have a shape of a bending structure of ashape “¬” (or a shape “∟” in a viewing direction) based on an integralshape of the first reinforcing member 1351 and the third reinforcingmember 1353, except for the second reinforcing member 1352.

FIG. 14 illustrates the shield structure 1360 (in particular, theconnecting member 1350) and part (e.g., weak part 1410) of the circuitboard 1330 at a viewing point viewing the first device 1301 from thesecond device 1302 side of FIG. 13 .

As illustrated in FIG. 14 , in the connecting member 1350, the thirdreinforcing member 1353 is stacked on the circuit board 1330, and thesecond reinforcing member 1352 is bent and in which at least part of thethird reinforcing member 1353 is extended to a length corresponding to aheight H of the circuit board 1330.

According to an embodiment, the weak part 1410 of the circuit board 1330may have a predetermined length (hereinafter, referred to as “lengthL”), and the third reinforcing member 1353 of the connecting member 1350may be stacked in a shape including a length corresponding to the lengthL, a length shorter than the length L, or a length longer than thelength L. FIG. 14 illustrates an example in which the third reinforcingmember 1353 is formed longer than a length L in which the weak part 1410is formed.

According to an embodiment, the second reinforcement member 1352 of theconnecting member 1350 may be bent from the third reinforcing member1353 to have a length corresponding to a length L of the weak part 1410or a length smaller than the length L. FIG. 14 illustrates an example inwhich the second reinforcing member 1352 is formed in a lengthcorresponding to a length L in which the weak part 1410 is formed.According to an embodiment, when a groove for fixing and mounting of thesecond reinforcement member 1352 is formed in the weak part 1410 of thecircuit board 1330, the second reinforcement member 1352 may have alength corresponding to or smaller than a length (or width) of a grooveof the weak part 1410.

FIGS. 15, 16, and 17 are diagrams illustrating a structure in which ashield structure shields a magnetic force between devices according tovarious embodiments of the disclosure.

Referring to FIG. 15 , a first device 1501, second device 1502, andthird device 1503 may be disposed at a circuit board (not illustrated),and the second device 1502 and the third device 1503 each may bedisposed adjacent to the first device 1501 to be affected by a magneticforce generated by a magnetic substance 1500 of the first device 1501.

According to an embodiment, as illustrated in FIG. 15 , the first device1501 may be a speaker (or receiver) including a magnetic substance 1500,the second device 1502 may be a back-facing camera disposed adjacentunder the first device 1501 and affected by a magnetic flux of themagnetic substance 1500, and the third device 1503 may be a front-facingcamera disposed adjacent beside the first device 1501 and affected by amagnetic flux of the magnetic substance 1500. Although not illustratedin FIG. 15 , a weak part of the circuit board may be formed between thefirst device 1501, the second device 1502, or the third device 1503, anda shield structure may be formed in the weak part. FIG. 15 schematicallyillustrates the shield member 1540 in the shield structure.

Referring to FIG. 15 , in various embodiments, a shield member 1540 mayhave a shield structure not to affect the second device 1502 and thethird device 1503 affected by the magnetic substance 1500 at a shieldspace (hereinafter, referred to as a “first shield space”) between thefirst device 1501 and the second device 1502 and a shield space(hereinafter, referred to as a “second shield space”) between the firstdevice 1501 and the third device 1503. According to an embodiment, theshield member 1540 may have a structure bent about (or based on) thefirst device 1501 (or the magnetic substance 1500 of the first device1501) in order to shield a magnetic force of the magnetic substance 1500in the first shield space and the second shield space. For example, theshield member 1540 may be at least partly bent so as to shield eachspace between devices (e.g., first shield space, second shield space).

According to an embodiment, the shield member 1540 may have a bent shapein a predetermined direction. According to an embodiment, a bendingstructure of the shield member 1540 may be designed in a shape of “¬” or“∟” or may be designed in a shape of “⊏” or “□”. For example, the shieldmember 1540 may be formed in a structure that may be shielded in anentire shield space according to a position (e.g., dispositionrelationship) of a device to be shielded and the number of devices to beshielded. According to an embodiment, one shield member 1540 may shielda magnetic force of a plurality of devices in a periphery thereofthrough a bending structure of the shield member 1540. According to anembodiment, although not illustrated, the shield member 1540 may befixed through a connecting member (not illustrated) formed in any oneweak part of weak parts of the circuit board formed between the devices.

Referring to FIG. 16 , a first device 1601, a second device 1602, and athird device 1603 may be disposed at a circuit board (not illustrated),and the second device 1602 may be disposed adjacent to the first device1601, the third device 1603 may be disposed adjacent to the seconddevice 1602, and the second device 1602 and the third device 1603 may beaffected by a magnetic force generated by a magnetic substance 1600 ofthe first device 1601.

According to an embodiment, as illustrated in FIG. 16 , the first device1601 may be a speaker (or receiver) including a magnetic substance 1600,the second device 1602 may be a first back-facing camera disposedadjacent under the first device 1601 and affected by a magnetic flux ofthe magnetic substance 1600, and the third device 1603 may be a secondback-facing camera disposed adjacent beside the second device 1602 butaffected by a magnetic flux of the magnetic substance 1600. For example,FIG. 16 illustrates an example in which the magnetic substance 1600 hasan influence on the third device 1603. Although not illustrated in FIG.16 , a weak part of a circuit board may be formed between the firstdevice 1601, the second device 1602, or the third device 1603, and ashield structure may be formed in the weak part. FIG. 16 schematicallyillustrates a shield member 1640 in the shield structure.

Referring to FIG. 16 , in various embodiments, the shield member 1640may have a shield structure so that the second device 1602 and the thirddevice 1603 are not affected by the magnetic substance 1600 in a shieldspace (hereinafter, referred to as a “first shield space”) between thefirst device 1601 and the second device 1602 and a shield space(hereinafter, referred to as a “second shield space”) between the firstdevice 1601 and the third device 1603. According to an embodiment, theshield member 1640 may extend a length thereof to shield a magneticforce of the magnetic substance 1600 in the first shield space and thesecond shield space. For example, the shield member 1640 may be formedlong by a length of the second device 1602 and the third device 1603 soas to shield both the second device 1602 and the third device 1603.According to an embodiment, the shield member 1640 may be formed in aflat plate structure (or shape “—”) extended to a length to cover boththe second device 1602 and the third device 1603. According to anembodiment, although not illustrated in FIG. 16 , in a dispositionstructure of devices illustrated in FIG. 16 , by forming the shieldmember 1640 in a bending structure as illustrated in FIG. 15 , theshield member 1640 may include a structure for shielding the magneticsubstance 1600 so that the magnetic substance 1600 does not affect thesecond device 1602 and the third device 1603.

Referring to FIG. 17 , a first device 1701, a second device 1702, and athird device 1703 may be disposed at a circuit board (not illustrated),the second device 1702 may be disposed adjacent to the first device1701, and the third device 1703 may be disposed adjacent to the seconddevice 1702 and only the second device may be affected by a magneticforce generated by a magnetic substance 1700 of the first device 1701.

According to an embodiment, as illustrated in FIG. 17 , the first device1701 may be a speaker (or receiver) including a magnetic substance 1700,the second device 1702 may be a first back-facing camera positionedadjacent under the first device 1701 and affected by a magnetic flux ofthe magnetic substance 1700, and the third device 1703 may be a secondback-facing camera positioned adjacent beside the second device 1702 butthat is not affected by a magnetic flux of the magnetic substance 1700.For example, FIG. 17 illustrates an example in which an influence by themagnetic substance 1700 does not reach the third device 1703.

With reference to FIG. 17 , in various embodiments, a shield member 1740may include a structure for shielding so that the second device 1702 isnot affected by the magnetic substance 1700 in a space (hereinafter,referred to as a shield space) between the first device 1701 and thesecond device 1702 affected by the magnetic substance 1700. According toan embodiment, the shield member 1740 may form a magnetic force of themagnetic substance 1700 in the shield space as much as a shieldablelength. For example, the shield member 1740 may be formed by a length ofthe second device 1602 so as to shield only the second device 1602, incomparison with the shield member 1640 of FIG. 16 . According to anembodiment, the shield member 1740 may be formed in a flat platestructure (or a shape “—”) capable of covering the second device 1702.

An electronic device according to various embodiments includes a firstdevice 510 including a first magnetic substance 515, a second device 520including a second magnetic substance 525, and a shield structure 560for shielding at least part of a magnetic force generated between thefirst magnetic substance 515 and the second magnetic substance 525,wherein the shield structure 560 includes a shield member 540 disposedbetween the first device 510 and the second device 520 and including aproperty of a magnetic substance and a connecting member 550 physicallyconnected to at least part of the shield member 540 and including aproperty of a nonmagnetic substance, wherein at least part of theconnecting member 550 is physically connected to a circuit board 530.

According to various embodiments, the shield member 540 may be made of amagnetic material capable of shielding the at least a partial magneticforce.

According to various embodiments, the shield member 540 may be formedwith SUS including a property of a ferromagnetic substance.

According to various embodiments, the connecting member 550 may be madeof a nonmagnetic material that may be magnetically separated from the atleast a partial magnetic force.

According to various embodiments, the nonmagnetic material may be madeof a metal that is not affected by a magnetic field.

According to various embodiments, the metal may include nickel silver.

According to various embodiments, the shield member 540 and theconnecting member 550 may contact each other with a SMD method.

According to various embodiments, at least one end of the shield member540 may be formed in a bending structure.

According to various embodiments, in the circuit board 530, grooves(e.g., a first groove 630 and a second groove 640) for fixing theconnecting member 550 may be formed.

According to various embodiments, the connecting member 550 may includefirst reinforcing members 610 and 710 including one surface contactingthe first groove 630 of the circuit board 530, second reinforcingmembers 620 and 720 including one surface contacting the second groove640 of the circuit board 530, and a third reinforcing member 730including an upper surface contacting a lower surface 655 of the circuitboard 530.

According to various embodiments, the other surfaces of the secondreinforcing members 620 and 720 may contact one surface of the shieldmember 540.

According to various embodiments, the first reinforcing members 610 and710 and the second reinforcing members 720 and 720 may be fixedvertically to both sides of the third reinforcing member 730.

According to various embodiments, the first reinforcing members 610 and710 and the second reinforcing members 620 and 720 may have differentwidths and lengths.

According to various embodiments, the circuit board (e.g., a circuitboard 1030 of FIG. 10 ) may include a weak part that may benefit fromreinforcement between the first device and the second device, the shieldstructure (e.g., a shield structure 1060 of FIG. 10 ) may be disposed atthe weak part, and the shield structure may reinforce the weak part withan elongated plate-like structure or a bending structure.

According to various embodiments, the connecting member (e.g., theconnecting member 1050 in FIG. 10 ) may function as a member forreinforcing strength of the weak part.

According to various embodiments, the connecting member (e.g., theconnecting member 1050 of FIG. 10 ) may have a length and widthcorresponding to a length and width of the weak part.

According to various embodiments, the shield member 540 may be disposedcloser (or leaned) to any device (e.g., the first device 510) based onat least functional characteristics of the first device 510 and thesecond device 520.

According to various embodiments, the functional characteristics mayinclude characteristics according to whether a driving method of thedevice is affected by the magnetic force.

According to various embodiments, the shield member 540 may be largerthan or equal to a size of the magnetic substance (e.g., the firstmagnetic substance 515) to be shielded.

According to various embodiments, at a distance (e.g., a length A)between the first device 510 and the second device 520, a distance(e.g., a length B) between the shield member 540 and the other magneticobject (e.g., the first magnetic substance 515) not to be shielded maybe a maximum separation distance.

An electronic device according to various embodiments includes a circuitboard 530, a first device 510 including a first magnetic substance 515,a second device 520 including a second magnetic substance 525, and ashield structure 560 for shielding at least part of a magnetic forcegenerated between the first magnetic substance 515 and the secondmagnetic substance 525, wherein the shield structure 560 includes ashield member 540 disposed between the first device 510 and the seconddevice 520 and including the property of a magnetic substance capable ofshielding at least a partial magnetic force, and a connecting member 550physically connected to at least part of the shield member 540 and fixedto the circuit board 530, and the connecting member 550 has a propertyof a nonmagnetic substance that may be magnetically separated from theat least a partial magnetic force.

According to various embodiments, at least part of the connecting member550 may be physically connected to the circuit board 530 and at leastanother portion may be physically connected to the shield member 540.

According to various embodiments, the shield member 540 may be disposedcloser (or leaned) to any device (e.g., the first device 510) based onat least functional characteristics of the first device 510 and thesecond device 520, but a distance (e.g., length B) between the shieldmember 540 and another magnetic substance (e.g., the second magneticsubstance 525) not to be shielded may be disposed to have a maximumseparation distance and may be equal to or larger than a size of themagnetic substance to be shielded.

An electronic device according to various embodiments includes a device(e.g., a first device 510) including a magnetic substance, a circuitboard 530, and a shield structure 560 for shielding at least part of themagnetic field generated by the magnetic substance, wherein the shieldstructure 560 includes a shield member 540 disposed between the device(e.g., a first device) and another device (e.g., a second device notincluding a magnetic substance) included in the electronic device andincluding a property of a ferromagnetic substance capable of shieldingat least a partial magnetic field and a connection member 550 physicallyconnected between at least part of the shield member 540 and the circuitboard 530, wherein the connecting member 550 has a property of anonmagnetic substance that may be magnetically separated from the atleast a partial magnetic field.

According to various embodiments, the shield member 540 and theconnecting member 550 may be connected with a SMD method.

According to various embodiments, the shield member 540 may be at leastpartly bent.

According to various embodiments, in the connecting member 550, thefirst members 610 and 710 may be disposed to correspond to the firstgroove 630 of the circuit board 530, the second members 620 and 720 maybe disposed to correspond to the second groove 640 of the circuit board530, and the third regions 630 and 730 may contact the lower surface 655of the circuit board 530, and the first region 710 and the second regionmay be fixed vertically to both sides of the third region, and thesecond region may contact at least part of the shield member 540.

According to various embodiments, by disposing (e.g., forming with a SMDmethod) a nonmagnetic material (e.g., nickel silver) and a magneticshield material, which is a magnetic material on a circuit board formedbetween the electronic components of the electronic device, a shieldstructure (shield member) may be formed. Thereby, according to variousembodiments, a contact structure may be implemented without limit whileminimizing a distance between the electronic components.

According to various embodiments, it is possible to increase the degreeof freedom with respect to a mounting position between electroniccomponents including a magnetic substance through a shield structure(shield member) made of heterogeneous materials capable of shielding amagnetic force between two adjacent magnetic substances, and bymaximizing a shield performance between magnetic substances, anoperation (function) error by an influence (interference) of a magneticforce between the electronic components can be prevented.

According to various embodiments, in an electronic device, even ifelectronic components each including a magnetic substance are disposedadjacent to each other, it is possible to operate without an error whileshielding an influence of the magnetic force on the other electroniccomponent. According to various embodiments, by simplifying aconfiguration of the shield structure, the shield structure can beeasily produced and be easily installed without detaching from thefixing member (e.g., circuit board).

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. A mobile electronic device, comprising: a circuitboard; a first device comprising a first magnetic part; a second devicecomprising a second magnetic part; and a shield structure, wherein theshield structure comprises: a first metal part configured to shield amagnetic force generated by the first magnetic part from the seconddevice, and a second metal part configured to reinforce the circuitboard, wherein the first metal part and the second metal part areattached to each other, wherein the first metal part is disposed betweenthe first device and the second device in a vertical standingorientation with respect to the circuit board, and wherein the secondmetal part comprises a hole for electrical wiring connection between thecircuit board and at least one device.
 2. The mobile electronic deviceof claim 1, wherein the circuit board comprises at least one circuitterminal, and wherein the hole is formed at a position corresponding tothe at least one circuit terminal formed in the circuit board.
 3. Themobile electronic device of claim 2, wherein the circuit board comprisesa plurality of circuit terminals for electrical connection with the atleast one device, and wherein the second metal part have a plurality ofholes at positions corresponding to each position of the plurality ofcircuit terminals.
 4. The mobile electronic device of claim 3, wherein aconnection wiring from the device is connected to the plurality ofcircuit terminals of the circuit board exposed through the plurality ofholes of the second metal part.
 5. The mobile electronic device of claim1, wherein the first metal part has plate-like structure capable ofshielding the magnetic force generated between the first device and thesecond device.
 6. The mobile electronic device of claim 1, wherein thefirst metal part is disposed closer to any one device between the firstdevice and the second device.
 7. The mobile electronic device of claim1, wherein the first metal part is disposed closer to one device sidebased on at least functional characteristics of the first device and thesecond device.
 8. The mobile electronic device of claim 1, wherein thefirst metal part and the second metal part are each made of a metal thatis not affected by the magnetic force generated by the first magneticpart from the second device.
 9. The mobile electronic device of claim 1,wherein the first metal part is formed of a metal material having amagnetic flux absorption property that is greater than a magnetic fluxabsorption property of a metal material forming the second metal part.10. The mobile electronic device of claim 1, wherein the first metalpart is formed of a ferromagnetic metal material and the second metalpart is formed of a non-magnetic metal material.
 11. The mobileelectronic device of claim 1, wherein the first metal part is made of afirst element or a first element based alloy, and wherein the secondmetal part is made of a second element or a second element based alloy.12. The mobile electronic device of claim 11, wherein the first elementincludes cobalt (Co), and wherein the second element includes at leastone of iron (Fe), nickel (Ni) or copper (Cu).
 13. The mobile electronicdevice of claim 1, wherein the first metal part and the second metalpart contact each other with a surface mount device (SMD) method. 14.The mobile electronic device of claim 1, wherein the first metal part isbent at least partially.
 15. The mobile electronic device of claim 1,wherein the second metal part is adhered to one surface of the circuitboard.
 16. The mobile electronic device of claim 1, wherein the firstmetal part and the second metal part are formed vertically.
 17. Themobile electronic device of claim 1, wherein the first metal part andthe second metal part have different widths and lengths.
 18. The mobileelectronic device of claim 1, wherein the first metal part and thesecond metal part each include a property of a nonmagnetic part for theshield.
 19. The mobile electronic device of claim 17, wherein at leastpart of the first metal part is directly connected to at least part ofthe second metal part on a side.
 20. The mobile electronic device ofclaim 1, wherein the second device corresponds to a camera component andthe first metal part is made of an alloy including cobalt (Co) so as toshield an auto focus mechanism of the camera component from a magneticflux of the first magnetic part.